Extended Data Fig. 7 | Cross-sectional TEM images of Co(80 nm)/TiN(3 nm)/
Si films after thermal diffusion tests at different temperatures. a–c, Images
obtained after thermal diffusion at 600 °C for 60 min (a), 600 °C for 30 min (b)
and 400 °C for 30 min (c). d, Magnified cross-sectional TEM image (right) and
EDS line profile (left) of the film shown in a.