Digital Circuit Fundamentals 1 Unit 1 – Circuit Board Introduction
Exercise 3 – IC Package Fundamentals
EXERCISE OBJECTIVE
When you have completed this exercise, you will be able to determine IC pin locations for LS
devices. You will verify your results on the circuit board.
DISCUSSION
- Logic IC devices are available in plastic or ceramic dual in-line package (DIP) packages. The
logic devices on the DIGITAL FUNDAMENTALS I circuit board use plastic DIPs. - The logic devices are not soldered directly to the printed circuit board but are inserted into
sockets. - Pins are counted in a clockwise (CW) direction from a bottom view or counterclockwise
(CCW) from a top view (beginning at pin 1). - Manufacturer’s provide specification sheets for their devices. Specific pin terminals and
circuit functions are examples of the type of information provided.