and replace components successfully, demonstrating that with limited training and tools these
low-level repairs are a realistic option for future missions. However, each crew member
experienced difficulties with some of the tasks. These problems range from forming solder
joints that are functional but do not pass current standards, to failed solder joints, and damage
to the component or circuit board. The difficulties encountered by the crew point to areas
requiring improvement. Further, the crew members were not trained to identify and correct
mistakes or flaws in their work, which contributed to the number of components that did not
pass a visual inspection to NASA standards. The results of the CRE-1 work show 2 main areas for
improving an electronics repair capability: improving crew training and improving the tools
provided.
PUBLICATIONS(S)
Easton JW, Struk PM. Component Repair Experiment-1: An experiment evaluating electronic
component –level repair during spaceflight. NASA Technical Memorandum. March 2012.
NASA/TM-2012-217022.
Easton JW, Pettegrew RD, Struk PM. Electronic repair concepts for long-duration spaceflight.
45th Aerospace Sciences Meeting and Exhibit, Reno, NV; 2007.
This investigation is complete; however additional results are pending publication.