SEMICONDUCTOR DEVICE PHYSICS AND DESIGN

(Greg DeLong) #1
9.5. MOSFET OPERATION 461

The saturation current is now, from equation 9.5.11,

ID(sat)=

(25× 10 −^4 )(600)

2(1. 5 × 10 −^4 )

(3.9)(8. 85 × 10 −^14 )

500 × 10 −^8

[5. 0 − 0 .04]^2

=8.5mA

Example 9.8Consider a silicon NMOS device at 300 K characterized by
φms=0,Na=4× 1014 cm−^3 ,dox= 200A ̊,L=1. 0 μm,Z=10μm. Calculate the
drain current for a gate voltage ofVGS= 5 V and drain voltage of 4 V. The electron
mobility in the channel is 700 cm^2 /V·s.
We start by calculating the threshold voltage. The potentialφFis given by

φF=(0.026) ln

(

4 × 1014

1. 5 × 1010

)

=0.264 V

The threshold voltage is, from equation 9.3.12,

VT =0.528 +

[

4(1. 6 × 10 −^19 )(11. 9 × 8. 85 × 10 −^14 )(4× 1014 )(0.264)

] 1 / 2

3. 9 × 8. 85 × 10 −^14

·

(

2 × 10 −^6

)

=0.58 V

The saturation voltage for a gate bias of 5 V is, from equation 9.5.7,

VDS(sat)=4.42 V

The saturation current is now, from equation 9.5.11,

ID(sat)=11.8mA

Example 9.9Consider ann-channel MOSFET with gate widthZ=10μm, gate lengthL
=2μm and oxide capacitanceCox=10−^7 F/cm^2. In the linear region, the drain current is
found to have the following values atVDS=0.1V:

VGS =1. 5 V, ID=50μA
=2. 5 V, ID=80μA

The intercept of theID−VGScurve is at− 0. 16 V, which is the threshold voltage.

Example 9.10Consider ann-channel MOSFET with a substrate doping of
Na=2× 1016
cm−^3 at 300 K. The SiO 2 thickness is 500A and a source-body bias of 1.0 V is applied. ̊
Calculate the shift in the threshold voltage arising from the body bias.
The potentialφFis given by

φF=0.026 ln

(

Na
ni

)

=0.026 ln

(

2 × 1016

1. 5 × 1010

)

=0.367 V
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