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Physics and Engineering of Radiation Detection

(Martin Jones) #1

  • 1 Properties and Sources of Radiation Preface xxiii

    • 1.1 TypesofRadiation............................

    • 1.2 WavesorParticles?............................

    • 1.3 RadioactivityandRadioactiveDecay

      • 1.3.A Decay Energy orQ-Value

      • 1.3.B TheDecayEquation.......................

      • 1.3.C CompositeRadionuclides

      • 1.3.D RadioactiveChain

      • 1.3.E Decay Equilibrium

        • E.1 Secular Equilibrium

        • E.2 Transient Equilibrium

        • E.3 No Equilibrium



      • 1.3.F BranchingRatio

      • 1.3.G UnitsofRadioactivity



    • 1.4 Activation.................................

    • 1.5 SourcesofRadiation

      • 1.5.A NaturalSources..........................

        • A.1 CosmicRadiationSources...................

        • A.2 TerrestrialRadiationSources

        • A.3 InternalRadiationSources



      • 1.5.B Man-MadeSources........................



    • 1.6 General Properties and Sources of Particles and Waves

      • 1.6.A Photons..............................

        • A.1 SourcesofPhotons.......................



      • 1.6.B Electrons

        • B.1 SourcesofElectrons



      • 1.6.C Positrons

        • C.1 SourcesofPositrons



      • 1.6.D Protons

        • D.1 SourcesofProtons



      • 1.6.E Neutrons

        • E.1 SourcesofNeutrons



      • 1.6.F AlphaParticles..........................

        • F.1 Sources ofα-Particles



      • 1.6.G FissionFragments

      • 1.6.H Muons,NeutrinosandotherParticles

        • H.1 Muons..............................

        • H.2 Neutrinos

        • H.3 SomeOtherParticles







  • 2 Interaction of Radiation with Matter

    • 2.1 SomeBasicConceptsandTerminologies

      • 2.1.A InverseSquareLaw........................

      • 2.1.B CrossSection

      • 2.1.C MeanFreePath

      • 2.1.D RadiationLength.........................

      • 2.1.E ConservationLaws........................

        • E.1 ConservationofEnergy

        • E.2 ConservationofMomentum..................

        • E.3 ConservationofElectricalCharge...............





    • 2.2 TypesofParticleInteractions

      • 2.2.A ElasticScattering.........................

      • 2.2.B InelasticScattering........................

      • 2.2.C Annihilation

      • 2.2.D Bremsstrahlung..........................

      • 2.2.E CherenkovRadiation.......................



    • 2.3 InteractionofPhotonswithMatter...................

      • 2.3.A InteractionMechanisms

        • A.1 PhotoelectricEffect

        • A.2 ComptonScattering

        • A.3 ThompsonScattering

        • A.4 RayleighScattering

        • A.5 PairProduction



      • 2.3.B PassageofPhotonsthroughMatter

        • B.1 MeasuringAttenuationCoefficient

        • B.2 Mixtures and Compounds

        • B.3 StackedMaterials





    • 2.4 Interaction of Heavy Charged Particles with Matter

      • 2.4.A RutherfordScattering

      • 2.4.B Passage of Charged Particles through Matter

      • 2.4.C BraggCurve

      • 2.4.D EnergyStraggling

      • 2.4.E RangeandRangeStraggling

        • E.1 Range ofα-Particles

        • E.2 RangeofProtons........................





    • 2.5 InteractionofElectronswithMatter

      • 2.5.A InteractionModes

        • A.1 Ionization............................

        • A.2 MoellerScattering

        • A.3 BhabhaScattering

        • A.4 Electron-PositronAnnihilation

        • A.5 Bremsstrahlung.........................

        • A.6 CherenkovRadiation......................



      • 2.5.B PassageofElectronsthroughMatter..............

      • 2.5.C EnergyStraggling

      • 2.5.D RangeofElectrons........................



    • 2.6 InteractionofNeutralParticleswithMatter..............

      • 2.6.A Neutrons

        • A.1 ElasticScattering........................

        • A.2 InelasticScattering.......................

        • A.3 Transmutation

        • A.4 RadiativeCapture

        • A.5 Spallation............................

        • A.6 Fission..............................

        • A.7 TotalCrossSection

        • A.8 PassageofNeutronsthroughMatter





    • 2.7 Problems



  • 3 Gas Filled Detectors

    • 3.1 ProductionofElectron-IonPairs

    • 3.2 DiffusionandDriftofChargesinGases

      • 3.2.A DiffusionintheAbsenceofElectricField

        • A.1 DiffusioninthePresenceofElectricField



      • 3.2.B DriftofChargesinElectricField................

        • B.1 DriftofIons...........................

        • B.2 DriftofElectrons........................



      • 3.2.C EffectsofImpuritiesonChargeTransport...........



    • 3.3 Regions of Operation of Gas Filled Detectors

      • 3.3.A RecombinationRegion......................

      • 3.3.B IonChamberRegion.......................

      • 3.3.C ProportionalRegion

        • C.1 AvalancheMultiplication



      • 3.3.D RegionofLimitedProportionality

      • 3.3.E Geiger-MuellerRegion......................

        • E.1 Breakdown



      • 3.3.F ContinuousDischarge



    • 3.4 IonizationChambers...........................

      • 3.4.A CurrentVoltageCharacteristics.................

      • 3.4.B MechanicalDesign

        • B.1 ParallelPlateGeometry....................

        • B.2 CylindricalGeometry



      • 3.4.C ChoiceofGas...........................

      • 3.4.D SpecialTypesofIonChambers.................

        • D.1 ParallelPlateFrischGridChamber

        • D.2 Boron-linedIonChamber

        • D.3 CompensatedIonChamber



      • 3.4.E ApplicationsofIonChambers..................

      • 3.4.F AdvantagesandDisadvantagesofIonChambers



    • 3.5 ProportionalCounters

      • 3.5.A MultiplicationFactor.......................

      • 3.5.B ChoiceofGas...........................

        • B.1 Threshold for Avalanche Multiplication

        • B.2 Quenching............................

        • B.3 GasGain



      • 3.5.C SpecialTypesofProportionalCounters

        • C.1 BF 3 ProportionalCounter...................

        • C.2 HeliumProportionalCounters

        • C.3 Multi-WireProportionalCounters





    • 3.6 Geiger-MuellerCounters.........................

      • 3.6.A Current-VoltageCharacteristics.................

      • 3.6.B DeadTime

      • 3.6.C ChoiceofGas...........................

      • 3.6.D Quenching.............................

        • D.1 InternalQuenching.......................

        • D.2 ExternalQuenching



      • 3.6.E Advantages and Disadvantages of GM Counters



    • 3.7 SourcesofErrorinGaseousDetectors

      • 3.7.A RecombinationLosses

      • 3.7.B EffectsofContaminants

        • B.1 RadiativeCapture

        • B.2 DissociativeCapture......................

        • B.3 CapturewithoutDissociation.................



      • 3.7.C EffectsofSpaceChargeBuildup



    • 3.8 DetectorEfficiency

      • 3.8.A Signal-to-NoiseRatio.......................





  • 4 Liquid Filled Detectors

    • 4.1 PropertiesofLiquids...........................

      • 4.1.A Charge Pair Generation and Recombination

      • 4.1.B DriftofCharges

        • B.1 DriftofElectrons........................

        • B.2 DriftofIons...........................





    • 4.2 LiquidIonizationChamber

      • 4.2.A Applications of Liquid Filled Ion Chambers



    • 4.3 LiquidProportionalCounters

      • 4.3.A ChargeMultiplication



    • 4.4 CommonlyUsedLiquidDetectionMedia................

    • 4.5 Sources of Error in Liquid Filled Ionizing Detectors

      • 4.5.A Recombination

      • 4.5.B Parasitic Electron Capture and Trapping



    • 4.6 CherenkovDetectors

    • 4.7 Bubble Chamber

    • 4.8 Liquid Scintillator Detectors



  • 5 Solid State Detectors

    • 5.1 Semiconductor Detectors

      • 5.1.A Structure of Semiconductors

      • 5.1.B ChargeCarriersDistribution

      • 5.1.C Intrinsic, Compensated, and Extrinsic Semiconductors

      • 5.1.D Doping

        • D.1 Doping with Acceptor Impurity

        • D.2 DopingwithDonorImpurity



      • 5.1.E Mechanism and Statistics of Electron-Hole Pair Production

        • E.1 IntrinsicEnergyResolution

        • E.2 Recombination



      • 5.1.F Charge Conductivity

        • F.1 DriftofElectronsandHoles..................



      • 5.1.G Materials Suitable for Radiation Detection

        • G.1 Silicon (Si)

        • G.2 Germanium (Ge)........................

        • G.3 Gallium Arsenide (GaAs)

        • G.4 Cadmium-Zinc-Tellurium (CdZnTe).............



      • 5.1.H Thepn-Junction

        • H.1 CharacteristicsofaReverse-Biasedpn-Diode

        • H.2 SignalGeneration

        • H.3 FrequencyResponse



      • 5.1.I ModesofOperationofapn-Diode

        • I.1 PhotovoltaicMode.......................

        • I.2 Photoconductive Mode



      • 5.1.J DesirableProperties

        • J.1 HighRadiationFields

        • J.2 LowRadiationFields



      • 5.1.K Specific Semiconductor Detectors

        • K.1 PINDiode

        • K.2 SchottkyDiode.........................

        • K.3 HeterojunctionDiode

        • K.4 AvalanchePhotodiode.....................

        • K.5 SurfaceBarrierDetector....................

        • K.6 PositionSensitiveDetectors..................



      • 5.1.L Radiation Damage in Semiconductors

        • L.1 DamageMechanismandNIELScaling............

        • L.2 LeakageCurrent

        • L.3 TypeInversion

        • L.4 DepletionVoltage

        • L.5 ChargeTrappingandCarrierLifetime

        • L.6 Annealing............................





    • 5.2 DiamondDetectors............................

      • 5.2.A ChargePairProduction

      • 5.2.B Recombination

      • 5.2.C DriftofChargePairs.......................

      • 5.2.D LeakageCurrent

      • 5.2.E DetectorDesign

      • 5.2.F RadiationHardness

      • 5.2.G Applications



    • 5.3 ThermoluminescentDetectors......................

      • 5.3.A PrincipleofThermoluminescence................





  • 6 Scintillation Detectors and Photodetectors

  • 6.1 Scintillation Mechanism and Scintillator Properties

    • 6.1.A Basic Scintillation Mechanism

    • 6.1.B LightYield

    • 6.1.C RiseandDecayTimes......................

    • 6.1.D Quenching.............................

      • D.1 SelfQuenching

      • D.2 ImpurityQuenching

      • D.3 ThermalQuenching

      • D.4 EnergyQuenching



    • 6.1.E DensityandAtomicWeight...................

    • 6.1.F Mechanical Properties and Stability

    • 6.1.G OpticalProperties

    • 6.1.H PhosphorescenceorAfterglow..................

    • 6.1.I TemperatureDependence

    • 6.1.J RadiationDamage

    • 6.1.K Scintillation Efficiency



  • 6.2 Organic Scintillators

    • 6.2.A Scintillation Mechanism

    • 6.2.B Plastic Scintillators

    • 6.2.C Liquid Scintillators

    • 6.2.D Crystalline Scintillators

      • D.1 Anthracene (C 14 H 10 )......................

      • D.2 P-Terphenyl (C 18 C 14 )

      • D.3 Stilbene (C 14 H 12 )





  • 6.3 Inorganic Scintillators

    • 6.3.A Scintillation Mechanism

      • A.1 ExcitonLuminescence

      • A.2 DopantLuminescence

      • A.3 CoreValenceBandLuminescence...............



    • 6.3.B RadiationDamage

    • 6.3.C Some Common Inorganic Scintillators

      • C.1 Thallium Doped Sodium Iodide (NaI:Tl)

      • C.2 Sodium Doped Cesium Iodide (CsI:Na)...........

      • C.3 Thallium Doped Cesium Iodide (CsI:Tl)

      • C.4 Bismuth Germanate (BGO)..................

      • C.5 Cadmium Tungstate (CWO)

      • C.6 Lead Tungstate (PWO)

      • C.7 Cerium Doped Gadolinium Silicate (GSO)

      • C.8 Cerium Doped Lutetium Aluminum Garnet (LuAG:Ce)

      • C.9 Cerium Doped Yttrium Aluminum Perovskite (YAP:Ce)

      • C.10LiquidXenon..........................





  • 6.4 Transfer of Scintillation Photons

    • 6.4.A TypesofLightGuides......................

      • A.1 SimpleReflectionType

      • A.2 TotalInternalReflectionType

      • A.3 HybridLightGuides......................





  • 6.5 Photodetectors

    • 6.5.A PhotomultiplierTubes......................

      • A.1 Photocathode..........................

      • A.2 ElectronFocusingStructure..................

      • A.3 ElectronMultiplicationStructure...............

      • A.4 VoltageDividerCircuit

      • A.5 ElectronCollection.......................

      • A.6 SignalReadout.........................

      • A.7 Enclosure

      • A.8 Efficiency

      • A.9 Sensitivity............................

      • A.10Gain...............................

      • A.11SpatialUniformity

      • A.12TimeResponse.........................

      • A.13FrequencyResponse

      • A.14EnergyResolution

      • A.15ModesofOperation

      • A.16NoiseConsiderations......................

      • A.17NoiseinAnalogMode

      • A.18NoiseinDigitalMode

      • A.19EffectofMagneticField....................

      • 6.5.B PhotodiodeDetectors

      • 6.5.C AvalanchePhotodiodeDetectors(APD)............

        • C.1 BasicDesirableCharacteristics

        • C.2 MultiplicationProcessandGainFluctuations........

        • C.3 QuantumEfficiencyandResponsivity

        • C.4 ModesofOperation

        • C.5 NoiseConsiderations......................

        • C.6 RadiationDamage







  • 7 Position Sensitive Detection and Imaging

    • 7.1 Some Important Terminologies and Quantities

      • 7.1.A SpatialResolution

        • A.1 Crosstalk

        • A.2 AliasingandAntialiasing

        • A.3 Point Spread Function (PSF)

        • A.4 Line Spread Function (LSF)

        • A.5 Edge Spread Function (ESF).................

        • A.6 Modulation Transfer Function (MTF)............



      • 7.1.B Efficiency

        • B.1 QuantumEfficiency

        • B.2 Spatial Detective Quantum Efficiency (DQE(f))



      • 7.1.C Sensitivity.............................

      • 7.1.D DynamicRange..........................

      • 7.1.E Uniformity

      • 7.1.F TemporalLinearity........................

      • 7.1.G Noise and Signal-to-Noise Ratio (S/N).............



    • 7.2 PositionSensitiveDetection.......................

      • 7.2.A TypesofPositionSensitiveDetectors..............

        • A.1 ArrayDevices..........................

        • A.2 ScanningDevices........................

        • A.3 TimingDevices.........................



      • 7.2.B Multiwire Proportional Chambers (MWPCs)

      • 7.2.C MultiwireDriftChamber

      • 7.2.D MicrostripGasChambers

      • 7.2.E Semiconductor Microstrip Detectors (SMSDs)



    • 7.3 ImagingDevices

      • 7.3.A ConventionalImaging

        • A.1 X-rayPhotographicFilms...................

        • A.2 ThermoluminescentDetectorArrays



      • 7.3.B ElectronicsImaging

      • 7.3.C ChargedCoupledDevices

      • 7.3.D DirectImaging

        • D.1 PropertiesofaDirectImagingCCD

        • D.2 DisadvantagesofDirectImaging



      • 7.3.E IndirectImaging

      • 7.3.F MicrostripandMultiwireDetectors

      • 7.3.G Scintillating Fiber Detectors





  • 8 Signal Processing

    • 8.1 Preamplification

      • 8.1.A VoltageSensitivePreamplifier..................

      • 8.1.B CurrentSensitivePreamplifier

      • 8.1.C ChargeSensitivePreamplifier..................

        • C.1 ResistiveFeedbackMechanism

        • C.2 PulsedResetMechanism





    • 8.2 SignalTransport

      • 8.2.A TypeofCable

        • A.1 CoaxialCable..........................

        • A.2 TwistedPairCable.......................

        • A.3 FlatRibbonCable





    • 8.3 PulseShaping...............................

      • 8.3.A DelayLinePulseShaping

      • 8.3.B CR-RCPulseShaping

        • B.1 Pole-ZeroCancellation.....................

        • B.2 BaselineShiftMinimization..................



      • 8.3.C Semi-GaussianPulseShaping..................

      • 8.3.D Semi-TriangularPulseShaping



    • 8.4 Filtering..................................

      • 8.4.A LowPassFilter..........................

      • 8.4.B HighPassFilter

      • 8.4.C BandPassFilter



    • 8.5 Amplification

    • 8.6 Discrimination

      • 8.6.A PulseCounting..........................

        • A.1 SingleChannelAnalyzer(SCA)................

        • A.2 MultiChannelAnalyzer(MCA)





    • 8.7 AnalogtoDigitalConversion

      • 8.7.A A/D-ConversionRelatedParameters..............

        • A.1 ConversionTime........................

        • A.2 DeadTime

        • A.3 Resolution............................

        • A.4 Nonlinearity...........................

        • A.5 Stability



      • 8.7.B A/DConversionMethods

        • B.1 DigitalRampADC.......................

        • B.2 SuccessiveApproximationADC................

        • B.3 TrackingADC

        • B.4 WilkinsonADC.........................

        • B.5 FlashADC



      • 8.7.C HybridADCs...........................



    • 8.8 DigitalSignalProcessing.........................

      • 8.8.A DigitalFilters...........................



    • 8.9 ElectronicsNoise

      • 8.9.A TypesofElectronicsNoise....................

        • A.1 JohnsonNoise

        • A.2 ShotNoise

        • A.3 1/fNoise

        • A.4 QuantizationNoise.......................



      • 8.9.B NoiseinSpecificComponents..................

        • B.1 NoiseinAmplifiers.......................

        • B.2 NoiseinADCs



      • 8.9.C MeasuringSystemNoise.....................

      • 8.9.D NoiseReductionTechniques...................

        • D.1 DetectorSignal.........................

        • D.2 FrequencyFilters........................







  • 9 Essential Statistics for Data Analysis

    • 9.1 MeasuresofCentrality..........................

    • 9.2 MeasureofDispersion

    • 9.3 Probability

      • 9.3.A FrequentistApproach

      • 9.3.B BayesianApproach........................

      • 9.3.C Probability Density Function

        • C.1 QuantitiesDerivablefromaP.D.F

        • C.2 MaximumLikelihoodMethod.................



      • 9.3.D SomeCommonDistributionFunctions.............

        • D.1 BinomialDistribution

        • D.2 PoissonDistribution

        • D.3 NormalorGaussianDistribution

        • D.4 Chi-Square (χ^2 )Distribution

        • D.5 Student’stDistribution

        • D.6 GammaDistribution......................





    • 9.4 Confidence Intervals

    • 9.5 MeasurementUncertainty

      • 9.5.A SystematicErrors

      • 9.5.B RandomErrors..........................

      • 9.5.C Error Propagation

        • C.1 AdditionofParameters

        • C.2 MultiplicationofParameters



      • 9.5.D PresentationofResults



    • 9.6 Confidence Tests

      • 9.6.A Chi-Square (χ^2 )Test.......................

      • 9.6.B Student’stTest..........................



    • 9.7 Regression.................................

      • 9.7.A SimpleLinearRegression

      • 9.7.B NonlinearRegression.......................



    • 9.8 Correlation

      • 9.8.A PearsonrorSimpleLinearCorrelation



    • 9.9 TimeSeriesAnalysis...........................

      • 9.9.A Smoothing



    • 9.10FrequencyDomainAnalysis.......................

    • 9.11CountingStatistics............................

      • 9.11.A Measurement Precision and Detection Limits





  • 10 Software for Data Analysis

    • 10.1StandardAnalysisPackages

      • 10.1.AROOT...............................

        • A.1 Availability

        • A.2 Data Handling, Organization, and Storage

        • A.3 Data Analysis Capabilities

        • A.4 Graphics Capabilities

        • A.5 UsingROOT

        • A.6 Examples



      • 10.1.B Origin

        • B.1 Data Import Capabilities

        • B.2 Graphics Capabilities

        • B.3 Data Analysis Capabilities

        • B.4 ProgrammingEnvironment

        • B.5 Examples



      • 10.1.C MATLAB

        • C.1 Toolboxes............................

        • C.2 Data Acquisition and Import Capabilities

        • C.3 Data Analysis Capabilities

        • C.4 Visualization Capabilities

        • C.5 ProgrammingEnvironment

        • C.6 Examples





    • 10.2Custom-MadeDataAnalysisPackages

      • 10.2.ADataImport/ExportRoutines

      • 10.2.BDataAnalysisRoutines

      • 10.2.CCodeGeneration

      • 10.2.DResultDisplay





  • 11 Dosimetry and Radiation Protection

    • 11.1ImportanceofDosimetry

    • 11.1.ADoseandDoseRate



  • 11.2QuantitiesRelatedtoDosimetry

    • 11.2.ARadiationExposureandDose..................

      • A.1 Roentgen (R)..........................

      • A.2 AbsorbedDose

      • A.3 EquivalentDose

      • A.4 EffectiveDose



    • 11.2.BFluxorFluenceRate

    • 11.2.CIntegratedFluxorFluence

    • 11.2.D Exposure and Absorbed Dose - Mathematical Definitions

    • 11.2.EKerma,Cema,andTerma....................

      • E.1 Kerma..............................

      • E.2 Cema

      • E.3 Terma..............................



    • 11.2.FMeasuringKermaandExposure

    • 11.2.GCavityTheories..........................

      • G.1 Bragg-Gray Cavity Theory

      • G.2 Spencer-AttixCavityTheory



    • 11.2.HLETandRBE..........................

    • 11.2.I BeamSize.............................

    • 11.2.J InternalDose

      • J.1 InternalDosefromChargedParticles

      • J.2 InternalDosefromThermalNeutrons





  • 11.3PassiveDosimetry

    • 11.3.AThermoluminescentDosimetry

      • A.1 WorkingPrincipleandGlowCurve..............

      • A.2 CommonTLMaterials.....................

      • A.3 AdvantagesandDisadvantagesofTLDosimeters......



    • 11.3.BOpticallyStimulatedLuminescenceDosimetry

      • B.1 WorkingPrincipleandOSLCurve

      • B.2 CommonOSLMaterials....................



    • 11.3.CFilmDosimetry..........................

      • C.1 AdvantagesandDisadvantagesofFilmDosimeters

      • C.2 CommonRadiochromaticMaterials



    • 11.3.DTrackEtchDosimetry

      • D.1 Advantages and Disadvantages of Track Etch Dosimeters





  • 11.4ActiveDosimetry.............................

    • 11.4.AIonChamberDosimetry.....................

      • A.1 FreeinAirIonChamberDosimetry

      • A.2 CavityIonChamberDosimetry................



    • 11.4.BSolidStateDosimetry

      • B.1 MOSFETDosimeter......................

      • B.2 DiamondDosimeter



    • 11.4.C Plastic Scintillator Dosimeter

    • 11.4.DQuartzFiberElectroscope....................

      • D.1 Advantages and Disadvantages of Quartz Fiber Electroscope





  • 11.5Microdosimetry..............................

    • 11.5.AMicrodosimetricQuantities

      • A.1 LinearEnergyTransferandDose...............

      • A.2 SpecificEnergy.........................

      • A.3 LinealEnergy..........................

      • 11.5.BExperimentalTechniques

        • B.1 Tissue Equivalent Proportional Counter (TEPC)

        • B.2 Solid State Nuclear Track Detector ((SSNTD)

        • B.3 Silicon Microdosimeter





    • 11.6BiologicalEffectsofRadiation......................

      • 11.6.AAcuteandChronicRadiationExposure

        • A.1 AcuteExposure

        • A.2 ChronicExposure



      • 11.6.BEffectsandSymptomsofExposure...............

        • B.1 SomaticEffectsofRadiation

        • B.2 GeneticEffectsofRadiation..................



      • 11.6.CExposureLimits



    • 11.7RadiationProtection...........................

      • 11.7.AExposureReduction

        • A.1 Time...............................

        • A.2 Distance.............................

        • A.3 Shielding







  • 12 Radiation Spectroscopy

    • 12.1SpectroscopyofPhotons.........................

      • 12.1.Aγ-RaySpectroscopy

      • 12.1.BCalibration

      • 12.1.CX-raySpectroscopy........................

        • C.1 X-rayAbsorptionSpectroscopy................

        • C.2 X-rayPhotoelectronSpectroscopy(XPS)

        • C.3 X-rayDiffractionSpectroscopy(XDS)





    • 12.2SpectroscopyofChargedParticles

      • 12.2.Aα-ParticleSpectroscopy

        • A.1 Energy of an Unknownα-Source

        • A.2 Range and Stopping Power ofα-particles in a Gas

        • A.3 Activity of anαSource



      • 12.2.BElectronSpectroscopy



    • 12.3NeutronSpectroscopy

      • 12.3.ANeutronsasMatterProbes

      • 12.3.BNeutronSpectrometryTechniques

        • B.1 Triple-AxisSpectrometry(TAS)

        • B.2 High Flux Backscattering Spectrometer (HFBS)

        • B.3 FilterAnalyzerSpectrometer(FAS)

        • B.4 DiskChopperSpectrometer..................

        • B.5 FermiChopperSpectrometer(FCS)

        • B.6 SpinEchoSpectrometer....................





    • 12.4MassSpectroscopy

    • 12.5TimeSpectroscopy



  • 13 Data Acquisition Systems

    • 13.1DataAcquisitionChain

      • 13.1.APulseCounting..........................

        • A.1 SlowPulseCounting......................

        • A.2 FastPulseCounting



      • 13.1.BEnergySpectroscopy.......................

      • 13.1.CTimeSpectroscopy........................

      • 13.1.DCoincidenceSpectroscopy



    • 13.2ModularInstruments...........................

      • 13.2.ANIMStandard

        • A.1 NIMLayout...........................

        • A.2 NIMModules..........................

        • A.3 NIMLogic

        • A.4 SignalTransport



      • 13.2.BCAMACStandard

        • B.1 CAMACLayout

        • B.2 CAMACControllers

        • B.3 CAMACLogic



      • 13.2.CVMEStandard..........................

        • C.1 VMELayout

        • C.2 VMEBackplane

        • C.3 VMEModules

        • C.4 VMELogic



      • 13.2.DFASTBUSStandard

        • D.1 FASTBUSLayout

        • D.2 FASTBUSBackplane





    • 13.3PCBasedSystems

      • 13.3.APCIBoards............................

      • 13.3.BPCSerialPortModules

      • 13.3.CPCParallelPortModules

      • 13.3.DUSBBasedModules

      • 13.3.ETCP/IPBasedSystems





  • Appendices

  • A Essential Electronic Measuring Devices

    • A.1 Multimeters................................

      • A.1.A MeasuringVoltageandCurrent.................

      • A.1.B AnalogMultimeter(AMM)

      • A.1.C DigitalMultimeter(DMM)

      • A.1.D MeasuringVoltage

      • A.1.E MeasuringCurrent........................



    • A.2 Oscilloscope

      • A.2.A Analog Oscilloscope

        • A.1 Attenuator

        • A.2 ElectronGun..........................

        • A.3 ElectronBeamDeflectionSystems

        • A.4 TriggerSystem



      • A.2.B Digital Oscilloscopes

      • A.2.C SignalProbes...........................

        • C.1 PassiveProbes







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