Mechanical APDL Structural Analysis Guide

(lily) #1
Constant Symbol Meaning
C1 σmax maximum normal contact stress [ 1 ]

δ contact gap at the completion of debonding
n

C2 c

maximum equivalent tangential contact
stress [ 1 ]

C3 τmax

tangential slip at the completion of debond-
ing

C4 δt

C5 η artificial damping coefficient
flag for tangential slip under compressive
normal contact stress; must be 0 (off ) or 1
(on)

C6 β


  1. For contact elements using the force-based model (see the description of KEYOPT(3) for CONTA175,
    CONTA176, and CONTA177), input a contact force value for this quantity.


To model bilinear material behavior with tractions and critical fracture energies, use TB,CZM with TBOPT
= CBDE. You also input the following material constants with the TBDATA command:


Constant Symbol Meaning
C1 σmax maximum normal contact stress [ 1 ]
critical fracture energy density (energy/area)
for normal separation [ 2 ]

C2 Gcn

maximum equivalent tangential contact
stress [ 1 ]

C3 τmax

critical fracture energy density (energy/area)
for tangential slip [ 2 ]

C4 Gct

C5 η artificial damping coefficient
flag for tangential slip under compressive
normal contact stress; must be 0 (off ) or 1
(on)

C6 β


  1. For contact elements using the force-based model (see the description of KEYOPT(3) for CONTA175,
    CONTA176, and CONTA177), input a contact force value for this quantity.

  2. For contact elements using the force-based model (see the description of KEYOPT(3) for CONTA175,
    CONTA176, and CONTA177), this quantity is critical fracture energy.


The following is an example of how to define a cohesive zone material with the TB and TBDATA
commands:


TB,CZM,,,,CBDD! bilinear behavior with tractions and separation distances
TBDATA,1,C1,C2,C3,C4,C5,C6

For more information on defining a cohesive zone material in a contact analysis, see Cohesive Zone
Material for Contact Elements in the Material Reference.


12.3.4. Result Output.


All applicable output quantities for contact elements are also available for debonding:


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Interface Delamination and Failure Simulation

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