Fundamentals of Materials Science and Engineering: An Integrated Approach, 3e

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GTBL042-09 GTBL042-Callister-v3 October 4, 2007 11:53


2nd Revised Pages

9.5 Principles of Fracture Mechanics • 295

(b)

Grains

SEM micrograph

Path of crack propagation

(a)

Figure 9.6 (a) Schematic
cross-section profile showing crack
propagation through the interior
of grains for transgranular
fracture. (b) Scanning electron
fractograph of ductile cast iron
showing a transgranular fracture
surface. Magnification unknown.
[Figure (b) from V. J. Colangelo
and F. A. Heiser,Analysis of
Metallurgical Failures,2nd edition.
Copyright©c1987 by John Wiley
& Sons, New York. Reprinted by
permission of John Wiley & Sons,
Inc.]

cross-sectional area (perpendicular to this load). Due to their ability to amplify an
stress raiser applied stress in their locale, these flaws are sometimes calledstress raisers.
If it is assumed that a crack is similar to an elliptical hole through a plate, and is
oriented perpendicular to the applied stress, the maximum stress,σm, occurs at the
crack tip and may be approximated by

σm= 2 σ 0

(


a
ρt

) 1 / 2


(9.1)


For tensile loading,
computation of
maximum stress at a
crack tip
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