GTBL042-10 GTBL042-Callister-v3 October 4, 2007 11:56
2nd Revised Pages
354 • Chapter 10 / Phase Diagrams
Composition (wt% Ni)
a
b
c
d
e
f
L
1300 + L
1200
1100
20 30 40 50 60
Temperature (
°C)
L (21 Ni)
L (21 Ni)
L (24 Ni)
L (29 Ni)
L (29 Ni)
L (35 Ni)
(46 Ni)
(40 Ni)
(35 Ni)
L (24 Ni)
(46 Ni)
(40 Ni)
(35 Ni)
(31 Ni)
(31 Ni)
(40 Ni) (46 Ni)
(42 Ni)
(46 Ni)
(46 Ni)
(40 Ni)
(35 Ni) (38 Ni)
(46 Ni)
(40 Ni)
(35 Ni)
(31 Ni)
L
(35 Ni)
Figure 10.5
Schematic
representation of the
development of
microstructure
during the
nonequilibrium
solidification of a 35
wt% Ni–65 wt% Cu
alloy.
at 1240◦C)—and is represented by the dashed line in Figure 10.5. There is no com-
parable alteration of the liquidus line inasmuch as it is assumed that equilibrium is
maintained in the liquid phase during cooling because of sufficiently rapid diffusion
rates.
At pointd′(∼ 1220 ◦C) and for equilibrium cooling rates, solidification should be
completed. However, for this nonequilibrium situation, there is still an appreciable
proportion of liquid remaining, and theαphase that is forming has a composition of
35 wt% Ni [α(35 Ni)]; also, theaverageα-phase composition at this point is 38 wt%
Ni [α(38 Ni)].
Nonequilibrium solidification finally reaches completion at pointe′(∼ 1205 ◦C).
The composition of the lastαphase to solidify at this point is about 31 wt% Ni; the
averagecomposition of theαphase at complete solidification is 35 wt% Ni. The inset
at pointf′shows the microstructure of the totally solid material.
The degree of displacement of the nonequilibrium solidus curve from the equi-
librium one will depend on rate of cooling. The slower the cooling rate, the smaller
this displacement; that is, the difference between the equilibrium solidus and aver-
age solid composition is lower. Furthermore, if the diffusion rate in the solid phase
is increased, this displacement will be diminished.