P1: PSB Printer: tb-gts4c
GTBL042-Index GTBL042-Callister-v3 October 17, 2007 1:38
862 • IndexCharpy impact test, 310–311, 841
Chevron markings, 293
Chips, semiconductor, 495
Chlorine, bonding energy and
melting temperature, 28
Chloroprene, repeat unit structure,
118, 835
Chloroprene rubber:
characteristics and applications,
556
melting and glass transition
temperatures, 838
Cis, 114, 841
Clay, characteristics, 594–595
Clay products, 540, 543
drying and firing, 543, 597–599
fabrication, 594–597
Cleavage (brittle fracture), 293
Clinker, 546
Close-packed ceramic crystal
structures, 79–80
Close-packed metal crystal
structures, 77–78
Coarse pearlite, 417–418, 428, 841
Coatings (polymer), 557
Cobalt:
atomic radius and crystal
structure, 40
Curie temperature, 735
as ferromagnetic material, 729
magnetization curves (single
crystal), 741
Coercivity (coercive force), 738,
841
Cold work, percent, 260
Cold working, 841 .See alsoStrain
hardening
Collector, 492–493
Color, 841
metals, 764–765
nonmetals, 772–773
Colorants, 607, 841
Compacted graphite iron, 518, 526,
529–530
Compliance, creep, 222
Component, 340, 378, 841
Composites:
aramid fiber-reinforced polymer,
639–640
carbon-carbon, 646–647, 840
carbon fiber-reinforced polymer,
638–639
ceramic-matrix, 645–646
classification scheme, 619–620
costs, 833definition, 9, 618
dispersion-strengthened, 624
elastic behavior:
longitudinal, 628–629
transverse, 631
fiber-reinforced,see
Fiber-reinforced composites
glass fiber-reinforced polymer,
637–638
hybrid, 647, 845
laminar, 619, 635, 651, 846
large-particle, 619, 620–624
metal-matrix, 644–645
particle-reinforced, 620–625
production processes, 648–650
properties, glass-, carbon-,
aramid-fiber reinforced, 640
rule of mixtures expressions, 620,
629, 631, 632, 633, 634, 643
strength:
longitudinal, 632
transverse, 633
stress-strain behavior, 627–628
structural, 650–652
Composition, 841
conversion equations, 138, 160
specification of, 136–137
Compression molding, plastics, 608
Compression tests, 190
Compressive deformation, 189, 211
Computers, semiconductors in,
494–496
Concentration, 136, 841 .See also
Composition
Concentration cells, 682
Concentration gradient, 166, 841
Concentration polarization,
673–674, 841
Concentration profile, 165, 841
Concrete, 622–624, 841
electrical conductivity, 496
plane strain fracture toughness,
300, 814
Condensation polymerization, 605,
841
Conducting polymers, 497–498
Conduction:
electronic, 463
ionic, 463, 497
Conduction band, 465, 841
Conductivity,seeElectrical
conductivity; Thermal
conductivity
Configuration, molecular, 111–113
Conformation, molecular, 109Congruent phase transformations,
372–373, 841
Constitutional diagrams,seePhase
diagrams
Continuous casting, 572–573
Continuous cooling transformation
diagrams, 426–429, 841
4340 steel, 429
0.35 wt% C steel, 457
0.76 wt% C steel, 427
for glass-ceramic, 542
Continuous fibers, 626
Conventional hard magnetic
materials, 745
Conversion factors, magnetic units,
726
Cooling rate, of cylindrical rounds,
583
Coordinates, point, 64–66
Coordination numbers, 41, 43,
46–47, 54, 841
Copolymers, 105, 116–117, 841
styrenic block, 562–563
Copper:
atomic radius and crystal
structure, 40
elastic and shear moduli, 193
electrical conductivity, 469
OFHC, 471
Poisson’s ratio, 193
recrystallization, 268, 413
slip systems, 249
thermal properties, 709
yield and tensile strengths,
ductility, 205
Copper alloys, 531–532
properties and applications of,
532
Copper-aluminum phase diagram,
444
Copper-beryllium alloys, 472, 531
phase diagram, 458
Copper-nickel alloys:
ductilityvs. composition, 259, 355
electrical conductivity, 470
phase diagram, 345–346
tensile strengthvs. composition,
259, 355
yield strengthvs. composition,
259
Copper-silver phase diagram, 356,
379
Coring, 355
Corningware (glass ceramic), 542
Corrosion, 841