P1: PSB Printer: tb-gts4c
GTBL042-Index GTBL042-Callister-v3 October 17, 2007 1:38
864 • IndexDensity (continued)
relation to percent crystallinity
for polymers, 119
values for various materials,
801–804
Design, component, 791
Design examples:
cold work and recrystallization,
268–269
conductivity of ap-type
semiconductor, 486–487
cubic mixed-ferrite magnet,
734–735
creep rupture lifetime for an
S-590 steel, 330–331
nonsteady-state diffusion,
176–177
spherical pressure vessel, failure
of, 301–304
steel shaft, alloy/heat treatment
of, 586–587
tensile-testing apparatus, 232–233
tubular composite shaft, 641–644
Design factor, 232
Design stress, 232, 842
Dezincification, of brass, 685
Diamagnetism, 727–728, 842
Diamond, 58, 550–551
as abrasive, 545
bonding energy and melting
temperature, 28
cost, 831
films, 550–551
hardness, 229
thermal conductivity, 820
Diamond cubic structure, 58
Die casting, 572
Dielectric breakdown, 491, 507
Dielectric constant, 500, 842
frequency dependence, 505–506
relationship to refractive index,
766
selected ceramics and polymers,
500
Dielectric displacement, 501, 842
Dielectric loss, 506
Dielectric materials, 498, 507, 842
Dielectric strength, 507, 842
selected ceramics and polymers,
500
Diffraction (x-ray), 83–84, 842
Diffraction angle, 86
Diffractometers, 85
Diffusion, 162–163, 842
grain growth and, 269in ionic materials, 177
in integrated circuit
interconnects, 178–179
in Si of Cu, Au, Ag, and Al, 178
interstitial, 164, 845
mechanisms, 163–164
and microstructure development,
351–355, 365–366
nonsteady-state, 167–171, 847
in polymers, 179–181
short-circuit, 177
steady-state, 165–167, 851
vacancy, 164, 177, 853
Diffusion coefficient, 166, 842
relation to ionic mobility, 497
temperature dependence,
172–177
values for various metal systems,
171
Diffusion couples, 162
Diffusion flux, 165, 842
for polymers, 179
Digitization of information/signals,
748–749, 783
Dimethyl ether, 101
Dimethylsiloxane, 118, 554–555,
556, 835.See alsoSilicones;
Silicone rubber
melting and glass transition
temperatures, 838
Diode, 490, 842
Dipole moment, 500
Dipoles:
electric, 31, 842
induced, 31
magnetic, 723–724
permanent, 32
Directional solidification, 331
Directions,seeCrystallographic
directions
Discontinuous fibers, 626
Dislocation density, 246, 284, 285,
842
Dislocation etch pits, 242
Dislocation line, 141, 142, 143,
842
Dislocation motion, 244–245
caterpillar locomotion analogy,
245–246
in ceramics, 271
at grain boundaries, 257–258
influence on strength, 257
recovery and, 264
Dislocations, 140–144, 842
in ceramics, 144, 246, 271characteristics of, 246–248
interactions, 247
multiplication, 248
at phase boundaries, 430, 435
pile-ups, 258
plastic deformation and, 199,
243–255, 256
in polymers, 137, 144
strain fields, 246–247
Dispersed phase, 619, 842
definition, 619
geometry, 619
Dispersion (optical), 759, 765
Dispersion-strengthened
composites, 624, 842
Disposal of materials, 793–794
Domain growth, 737–738
iron single crystal, 722
Domains, 730, 736–737, 742,
842
Domain walls, 736–737
Donors, 477, 842
Doping, 480, 483–484, 842
Double bonds, 98–99
Drain casting, 596
Drawing:
glass, 592
influence on polymer properties,
276–277
metals, 571, 842
polymer fibers, 610–611, 842
Drift velocity, electron, 468
Driving force, 166, 842
electrochemical reactions, 665
grain growth, 269
recrystallization, 264
sintering, 601
steady-state diffusion, 166
Dry corrosion, 691
Drying, clay products, 597–598
Ductile fracture, 203–204, 290–292,
842
Ductile iron, 525, 526, 842
compositions, mechanical
properties, and applications,
527
Ductile-to-brittle transition,
311–314, 842
polymers, 308
and temper embrittlement, 437
Ductility, 203–204, 842
fine and coarse pearlite, 432
precipitation hardened aluminum
alloy, 445
selected materials, 205, 809–813