P1: PSB Printer: tb-gts4c
GTBL042-Index GTBL042-Callister-v3 October 17, 2007 1:38
872 • IndexMicrostructure, 149, 847
austenite, 382
bainite, 419
bonded ceramic abrasive, 546
brass during recrystallization and
grain growth, 265–266
carbon-black-reinforced rubber,
622
carbon nanotube, 60
cast irons, 525–526, 528
cemented carbide, 622
coarse and fine pearlite, 418
compacted graphite iron, 526
craze in poly(phenylene oxide),
310
development in eutectic alloys,
361–369
development in iron-carbon
alloys, 384–391
development in isomorphous
alloys:
equilibrium cooling, 351–353
nonequilibrium cooling,
353–355
eutectic (lead-tin), 365
ferrite (α), 382
glass fracture surface, 307
gray cast iron, 525
hypereutectoid steel alloy, 389
hypoeutectoid steel alloy, 339, 387
influence of cooling rate, 580
integrated circuit, 460, 495
magnetic storage disk, 748, 749
martensite, 422
metastable, 343
microscopic examination,
149–154
pearlite, 385, 418
pearlite partially transformed to
spheroidite, 421
polycrystalline metal before and
after deformation, 255
porcelain, 599
precipitation-hardened aluminum
alloy, 400
single-phase iron-chromium alloy,
152
sintered ceramic, 602
size ranges, various structural
features, 154
spheroidite, 420
spherulite (natural rubber), 97
stress corrosion in brass, 687
TEM (high resolution)–single
crystals of (Ce 0. 5 Zr 0. 5 )O 2 , 148tempered martensite, 435
Microvoids, 290–291, 309
Miller-Bravais index system, 68–69
Miller indices, 70–73, 847
Minority charge carriers, 479
Mirror region, 307–308
Mist region, 307–308
Mixed dislocations, 141, 143, 244,
847 .See alsoDislocations
Mobility, of charge carriers,
467–468, 847
influence of dopant content,
483–484
influence of temperature, 484–485
ionic, 497
values for selected
semiconductors, 474
Modulus of elasticity, 192–194, 847
anisotropy, 82
atomic bonding and, 194–195, 237
carbon nanotubes, 60
copper reinforced with tungsten,
621
influence of porosity on, in
ceramics, 213–214
ranges for material types (bar
chart), 6
relation to shear modulus, 197
selected ceramics, 193, 806
selected fiber-reinforcement
materials, 636, 807
selected metals, 193, 804–806
selected polymers, 193, 806–807
temperature dependence:
elastomers, 279
metals, 195
and thermal fatigue, 325
and thermal stresses, 716–718
values for various materials,
804–807
Modulus of resilience, 204–206
Modulus of rupture, 212.See also
Flexural strength
Mohs hardness scale, 222, 226, 227
Molarity, 664, 847
Molding, plastics, 608–610, 847
Mole, 17, 847
Molecular chemistry, polymers,
101–105, 847
Molecular configurations,
polymers, 111–115
Molecular mass, 106
Molecular materials, 34
Molecular shape, polymers,
108–109Molecular structure, polymers,
109–111, 847
Molecular weight, 847
influence on polymer
melting/glass transition
temperatures, 450–451
influence on mechanical
behavior, polymers, 274, 276
number-average, 106–108
weight-average, 106–108
Molecular weight distribution,
106–107
Molecules, polar, 32, 848
Molybdenum, 536, 538
atomic radius and crystal
structure, 40
density, 802
modulus of elasticity, 805
Poisson’s ratio, 808
properties as wire, 636
slip systems, 249
thermal properties, 816, 820, 823
yield and tensile strengths,
ductility, 205
Moment of inertia, 211–212, 239,
642
Monel, 538
Monoclinic crystal system, 61, 62
Monomers, 100, 847
MOSFET transistors, 491, 493–494,
847
Mullite, 377, 544, 545
flexural strength, 205
modulus of elasticity, 193
Poisson’s ratio, 193
Muntz metal, 531
Muscovite (mica), 57N
Nanotechnology, 12–13
Nanotubes, carbon, 13, 60
Natural aging, 446, 847
Natural rubber (polyisoprene),
114, 552, 556
degradation resistance, 696
melting and glass transition
temperatures, 838
stress-strain behavior, 280
thermal properties, 709
NBR,seeNitrile rubber (NBR)
Necking, 201
complex stress state in, 208
in ductile fracture, 290–291
polymers, 217
N ́eel temperature, 735