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GTBL042-Index GTBL042-Callister-v3 October 18, 2007 20:15
2nd Revise Page878 • IndexSemiconductors (continued)
n-type, 477–479, 847
p-type, 479–480, 849
temperature dependence:
electron concentration,n-type
Si, 482
electron mobility, Si, 484
hole mobility, Si, 484
intrinsic carrier concentration of
Ge, 481
intrinsic carrier concentration of
Si, 481
Semicrystalline polymers, 119
deformation mechanisms:
elastic, 272–273
plastic, 274, 275
Sensors, 12, 547
Severity of quench, 581
Shape memory:
alloys, 12
phase transformations, 439–441
Shear deformation, 189, 211
Shear modulus, 195
relationship to elastic modulus,
197
selected metals, 193
Shear strain, 191, 850
Shear stress, 191, 850
resolved, 250
resolved from tensile stress,
191–192
Shear tests, 191
Sheet glass forming (float process),
592–593
Shot peening, 324
Shrinkage, clay products, 597–598
Shrink-wrap polymer films, 278
Silica, 54
crystalline and noncrystalline
structures, 88
fibers for optical communications,
549, 784–785
fused,seeFused silica
as refractory, 544
Silica-alumina phase diagram, 377
Silica glasses, 89
viscosity, 591
Silicates:
glasses, 89
layered, 55–56
tetrahedral structure, 54
types and structures, 54–57, 89
Silicon:
bonding energy and melting
temperature, 28conduction in, 476
cost, 832
electrical characteristics, 474
electron concentrationvs.
temperature,n-type, 482
electron/hole mobilityvs.
impurity concentration, 483
electron/hole mobilityvs.
temperature, 484
fracture toughness, 548
intrinsic carrier concentrationvs.
temperature, 481
in MEMS, 548
vacancy (surface), 127
Silicon carbide:
as abrasive, 545
flexural strength, 205, 812
hardness, 229
modulus of elasticity, 193, 806
properties as whiskers and fibers,
636
as refractory, 545
Silicon dioxide,seeSilica
Silicone rubber, 554–556
characteristics and applications,
556
degradation resistance, 696
Silicon nitride:
ceramic ball bearings, 549
compressive strength, 549
flexural strength, 205, 812
fracture strength distribution, 305
hardness, 549
modulus of elasticity, 193, 806
properties as a whisker, 636
Silly putty, 218
Silver, 538
atomic radius and crystal
structure, 40
electrical conductivity, 469, 471
slip systems, 249
thermal properties, 709
Simple cubic crystal structure, 92
Single crystals, 80, 850
slip in, 250–253
Sintered aluminum powder (SAP),
624
Sintering, 601, 850
SI units, 799–800
Ski, cross-section, 617
Slip, 199, 245, 850
compared to twinning, 256
polycrystalline metals, 253–255
single crystals, 250–253
Slip casting, 596–597, 850Slip direction, 248
Slip lines, 251, 254
Slip plane, 244, 245, 248
Slip systems, 248–249, 850
selected metals, 249
Small-angle grain boundaries, 145,
258
Smart materials, 11–12
Societal considerations, materials
science, 792–797
Soda-lime glasses:
composition, 541
dielectric properties, 500
electrical conductivity, 496
thermal properties, 709
thermal shock, 718
viscosity, 591
Sodium chloride:
bonding energy and melting
temperature, 28
ionic bonding, 27
structure, 49, 80
Sodium-silicate glass, 89
Softening point (glass), 590, 851
Soft magnetic materials, 741–744,
851
properties, 744
Soils, as corrosion environments,
689
Soldering, 362, 573, 851
Solders, lead-free, 362
Solid-solution strengthening,
259–260, 355, 851
Solid solutions, 134–135, 851
in ceramics, 135
intermediate, 369, 372, 845
interstitial, 134–135, 845
in metals, 134–135
ordered, 369, 531
terminal, 369, 852
Solidus line, 346, 356, 851
Solubility limit, 341, 851
factors that influence for solid
phases, 134
Solutes, 851
defined, 133
Solution heat treatment, 442, 851
Solvents, 851
defined, 133
Solvus line, 356, 851
Sonar, use of piezoelectric ceramics
in, 550
Specific heat, 706, 851
values for selected materials, 709,
822–824