unit cells are identical in our design. Metal interconnects and sensors are mainly
encapsulated in longitudinal ribbons (Fig.5.10b). The ribbons in imaging experi-
ments are 20-μm-wide and 700-nm-thick for SU-8 and 10-μm-wide and
100-nm-thick for metal. Different width of mesh was used for investigating the
Fig. 5.10 Parameters for injection.aSchematic shows the structure of the pulled glass tube for
testing and imaging the structure of different electronics design in the needle. Red arrow indicates
the direction of injection.bSchematics of design for injection. The dashed black circles highlight
the detailed structure where red represents supporting and passivation polymer and yellow
represents metal lines.cOptical images of different electronics design injected through glass
needle. (I–II) 5 mm wide meshes as design in (b, I) were injected through 450 and 250lmID
glass needle; (III) 15 mm wide mesh as design in (b, I) was injected through 450lm ID needle.
(V) 10 mm mesh as design in (b, II) was injected through 450lm ID needle.dTop view of 3D
reconstructed confocal images corresponding to (c). White arrows in (candd) highlight metal
contacts in the mesh.eImages at cross-sections as indicated by white dashed lines in (c). White
dashed curves in e highlight the cross-section of needle boundary
82 5 Syringe Injectable Electronics