Molex claims first SMT potting
connector system
Molex claims the industry’s first SMT
potting wire-to-board connector
system with the introduction of
the Spot-On 1.5 and 2.0. Molex
said that the new potting system will
provide increased processing capability and
mechanical reliability in home appliances such as
washer/dryers, stoves, and air conditioners.
The Spot-On connector system utilizes SMT-type potting connectors in conjunc-
tion with center PCB nails to absorb the stress caused by temperature fluctuation
during operation, thereby reducing cracking in the soldering. A potting sealant
protects against water damage while the potential for latch failure is diminished by an
inner positive lock design.
Automated SMT mounting tails on each Spot-On connector save time and effort
during assembly, and a polarized, color-coded receptacle housing simplifies the
wire-mating process. All single-row and double-row connectors also feature a retainer
for more secure insertion of the crimped terminal.
The Spot-On Connector System provides 1.0 to 3.0 A of current and up to 36
available circuits, and the 1.50-mm and 2.00-mm pitch make it smaller and more
space-efficient than its predecessors.
Molex: http://www.molex.com
Card-edge power connectors deliver high current density
TE Connectivity recently released its high-density-plus (HD+) card-edge power
connectors for data centers. The card-edge power connectors offer the highest current
density for these types of interconnects, according to the company, and support
power supplies up to 3 kW. These new interconnects enable systems with increasing
power requirements in next-generation data centers.
“TE’s new HD+ card-edge power connectors not only support the highest current
density among all card-edge connectors in the market, but they can offer strong
dependability through our dual-layer contact design,” said Bandy Yuan, product
manager, TE Connectivity.
Delivering a current density of 15 A/2.54 mm, the HD+ card-edge connectors
support 2,000- to 3,000-W power supplies for data center equipment. They feature
a 1.27-mm signal contact pitch and a 5.08-mm power contact pitch with a working
voltage of 60 VDC.
The connectors also boast low contact resistance thanks to the dual-layer design
of the DC power contacts and pass-through pins, which facilitate multiple mating/
contact points to the PCB. They’re designed in the common industry PCB footprint,
leveraging a compact and cost-effective design with a common power and signal
contact module, said TE.
In addition, the connectors deliver a flexible configuration with
different contact quantities and positions and support
both AC and DC in low-power and high-power
applications, helping designers attain
better scalability. The connec-
tors target server, switch,
and mass storage system
applications.
TE Connectivity: http://www.te.com
Packaging & Interconnects NEW PRODUCTS 27
ELECTRONIC PRODUCTS • electronicproducts.com • JANUARY 2019