16-12 IMPLEMENTING SPC 641- Conveyor speed
- Conveyor angle
- Solder wave height
- Preheat temperature
- Pallet loading method
A statistically designed experimentcould be used to investigate the effect of these seven vari-
ables on solder defects.
In addition, the team constructed a defect concentration diagramfor the product. A de-
fect concentration diagram is just a sketch or drawing of the product, with the most frequently
occurring defects shown on the part. This diagram is used to determine whether defects occur
in the same location on the part. The defect concentration diagram for the printed circuit board
is shown in Fig. 16-24. This diagram indicates that most of the insufficient solder defects are
near the front edge of the board, where it makes initial contact with the solder wave. Further
investigation showed that one of the pallets used to carry the boards across the wave was bent,
causing the front edge of the board to make poor contact with the solder wave.
When the defective pallet was replaced, a designed experiment was used to investigate
the seven variables discussed earlier. The results of this experiment indicated that several of
these factors were influential and could be adjusted to reduce solder defects. After the results
of the experiment were implemented, the percentage of solder joints requiring rework was re-
duced from 1% to under 100 parts per million (0.01%).
16-12 IMPLEMENTING SPCThe methods of statistical process control can provide significant payback to those companies
that can successfully implement them. While SPC seems to be a collection of statistically
based problem-solving tools, there is more to the successful use of SPC than simply learning
and using these tools. Management involvement and commitment to the quality-improvement
process is the most vital component of SPC’s potential success. Management is a role model,
and others in the organization will look to management for guidance and as an example. A
team approach is also important, for it is usually difficult for one person alone to introduce
process improvements. Many of the “magnificent seven’’ problem-solving tools are helpful in
building an improvement team, including cause-and-effect diagrams, Pareto charts, and defect
concentration diagrams. The basic SPC problem-solving tools must become widely known
and widely used throughout the organization. Continuous training in SPC and quality im-
provement is necessary to achieve this widespread knowledge of the tools.
The objective of an SPC-based quality-improvement program is continuous improve-
ment on a weekly, quarterly, and annual basis. SPC is not a one-time program to be appliedFrontRegion of insufficient solderBackFigure 16-24 Defect
concentration diagram
for a printed circuit
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