7.4 FIELD-EFFECT TRANSISTORS 373DS++−−G
vGS > 0vDS > 0iDn+n+ElectronsHoles(a)
Electric
fieldD
n–type
channelDepletion
regionS+−GvGS > VTn+nn+p
d(b)+−vDS > vGS − VTiDDS++−−GvGS > VTvGD < VT
n+nn+d p(c)Figure 7.4.6Internal physical picture in ann-channel enhancement MOSFET.(a)Movement of electrons
and holes due to electric field.(b)Formation ofn-type channel.(c)Pinched-down channel.
iDvDS
vGS − VT BVDSOhmic
stateBreakdownConstant–current
state0Figure 7.4.7IdealizediD–vDScurve of ann-channel enhance-
ment MOSFET with fixedvGS>VT.50 V, at which the drain current abruptly increases and may damage the MOSFET due to heat if
operation is continued. Thegate breakdown voltage,at about 50 V, may also cause a sudden and
permanent rupture of the oxide layer.
Figure 7.4.8 shows the characteristics of a typicaln-channel enhancement MOSFET. In the
ohmic region wherevGS>VTandvDS<vGS−VT, the drain current is given by
iD=K[
2 (vGS−VT)vDS−vDS^2]
(7.4.6)
whereKis a constant given byIDSS/VT^2 having the unit of A/V^2 , andIDSSis the value ofiDwhen
vGS= 2 VT. The boundary between ohmic and active regions occurs whenvDS=vGS−VT. For
vGS>VTandvDS≥vGS−VT, in the active region, the drain current is ideally constant and
given by
iD=K(vGS−VT)^2 (7.4.7)
To account for the effect ofvDSoniD, however, a factor is added,iD=K(vGS−VT)^2(
1 +vDS
VA)
(7.4.8)whereVAis a constant that is in the range of 30 to 200 V. Then-channel enhancement MOSFET
with characteristics depicted in Figure 7.4.8 has typical values ofVT=4V,VA=200 V, and
K= 0 .4 mA/V^2.
The small-signal equivalent circuit for low frequencies is of the same form as Figure 7.4.4
for a JFET, withgmandroevaluated from the equations