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GTBL042-Index GTBL042-Callister-v3 October 17, 2007 1:38
Index • 877plane strain fracture toughness,
814
thermal properties, 817, 820, 823Q
Quantum mechanics, 17, 849
Quantum numbers, 18–21, 849
magnetic, 19, 727
Quartz, 54–55, 595, 599
hardness, 229
index of refraction, 767
as piezoelectric material, 509
Quenching media, 581–583R
Radiation effects, polymers, 697
Random copolymers, 116, 849
Range of stress, 315, 316
Recombination, electron-hole, 490,
769, 776
in light-emitting diodes, 776
Recovery, 264, 849
Recrystallization, 264–267, 575, 849
effect on properties, 267
kinetics for copper, 413
Recrystallization temperature,
264–265, 267–268, 849
dependence on alloy content, 265
dependence on percent cold
work, 264–265
selected metals and alloys, 268
Rectification, 490–491
Rectifying junctions, 490, 849
Recycling:
issues in materials science and
engineering, 794–797
of beverage cans, 789
of composite materials, 797
of glass, 795
of metals, 795
of plastics and rubber, 795–797
Recycling codes and products, 796
Reduction (electrochemical), 662,
849
Reduction in area, percent, 204
Reflection, 767, 849
Reflectivity, 763, 771
Refraction, 759, 765–766, 849
index of, 765, 845
Refractories (ceramics), 540,
543–545, 849
corrosion, 694
Refractory metals, 536, 538
Reinforced concrete, 623–624,
849Reinforcement efficiency, table of,
635
Relative permeability, 725, 726, 849
Relative permittivity,seeDielectric
constant
Relaxation frequency, 506, 849
Relaxation modulus, 218–221, 850
Remanence (remanent induction),
738, 850
Repeated stress cycle, 315–316
Repeat units,
bifunctional and trifunctional, 105
table of, 104–105
Residual stresses, 575, 850 .See also
Thermal stresses
glass, 593
martensitic steels, 434
Resilience, 204, 850
Resin, polymer, 637
Resistance (electrical), 461
Resistivity, 850 .See alsoElectrical
resistivity
Resolved shear stresses, 250, 850
Retained austenite, 422, 423
Reverse bias, 490, 850
Reversed stress cycle, 315–316
Rhodium, 538
Rhombohedral crystal system, 61,
62
Rochelle salt, 507
Rock salt structure, 49, 51
Rockwell hardness tests, 186,
223–225
Rolling, of metals, 570–571, 850
Rouge, 546
Rovings, 648
Rubbers, 109, 117
natural,seeNatural rubber
(polyisoprene)
synthetic, 116, 552, 554, 555–556
trade names, characteristics, and
applications, 556
Rubbery region, polymers, 220
Ruby,see alsoAluminum oxide
lasers, 778–779
optical characteristics, 773
Rule of mixtures, 850
composites, 620–621, 629, 631,
632, 633, 634, 643
electrical resistivity, 470
Rupture, 326, 850
Rupture lifetime, 327
extrapolation of, 329–330
Rust, 663
Ruthenium, 538S
Sacrificial anodes, 690, 850
Safe stress, 232, 850
Safety factors, 232, 302
Samarium-cobalt magnets, 746
Samarium-iron garnet, 756
Sand casting, 572
Sandwich panels, 619, 651–652, 850
Sapphire,see alsoAluminum oxide
optical transmittance, 773
Saturated hydrocarbons, 99, 850
Saturation, extrinsic
semiconductors, 482
Saturation magnetization, 730, 734,
737–738, 850
temperature dependence, 736
SBR,seeStyrene-butadiene rubber
Scaling, 691
Scanning electron microscopy, 153,
850
Scanning probe microscopy, 12,
127, 153–154, 850
Scanning tunneling microscope, 60
Schottky defect, 130–131, 177, 850
equilibrium number, 132–133
Scission, 697, 850
Scleroscope hardness, 226
Screw dislocations, 141, 143, 244,
245, 850 .See alsoDislocations
in polymers, 137
Seawater, as corrosion
environment, 688
Secant modulus, 193–194
Secondary bonds, 31–32, 850
Secondary creep, 326–327
Segregation, 355
Selective leaching, 685, 850
Self-diffusion, 163, 850
Self-interstitials, 129, 850
SEM,seeScanning electron
microscopy
Semiconductor devices, 489–496
Semiconductor lasers, 780–781
Semiconductors:
band structure, 465, 466–467
carbon nanotubes as, 60
in computers, 494
costs, 831, 832
defined, 11, 463, 850
extrinsic, 477–481, 843
fullerenes as, 59
intrinsic, 474–477, 845
intrinsic carrier concentration,
475, 481
light absorption, 768–770