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Chapter 5 Syringe Injectable Electronics 5.1 Introduction........................................ With recent advancement in nan ...
5.2 Experimental 5.2.1 Freestanding Mesh Electronics Fabrication............ Uniform single-crystalline nanowires were synthesiz ...
ribbon perpendicular to the injection direction as the transverse ribbon. Transverse ribbons are tilted witha= 45° to transverse ...
350-nm thick SU-8 layers. For the ribbons without metal contact lines, the total SU-8 thickness is ca. 700 nm. Transverse ribbon ...
poly-D-lysine aqueous solution for 2–12 h at 25 °C for surface modification. After surface modification, electronics was transfe ...
structure was incubated in 37 °C to investigate the unfolding of electronics in MatrigelTM. Co-inject mesh electronics with cell ...
a 12 h: 12 h light: dark cycle. All animals were held in a facility beside lab 1 week prior to surgery, post-surgery and through ...
5.2.5 Mechanical Analysis............................ Bending stiffness: We estimate the bending stiffness of the devices with d ...
curvature of the electronics scales as1/L, the bending energy scales [ 25 ]asDw/ L, withwis the width of the electronics. The su ...
(3.3 103 – 1.3 105 )[ 10 ]. Therefore the design of injectable mesh electronics exhibits significantly more mechanicalflexibil ...
electronics was transferred to DI water and dried in ethanol, while the released I/O region was unfolded on the substrate. (2) A ...
process described above. However, electronics was only partially injected through the needle. Confocalfluorescence microscope wa ...
5.2.8 Chronic Damage Analysis........................ Brain slice preparation: (1) Mice underwent transcardial perfusion (40 mL ...
gold coverslips were used again to protect from light and allowed for 12 h of clearance before imaging. When the antibody soluti ...
units, metal interconnects and input/output (I/O) pads distribute in this freestanding network (Fig.5.1). We can load mesh elect ...
injected solution less than 100 nL in each injection to minimize the invasiveness (Fig.5.8). Injected mesh electronics can gradu ...
(100μm, ID) to 98% (400μm, ID) with less than 10% impedance change in average. Altogether, results show robustness of mesh elect ...
unit cells are identical in our design. Metal interconnects and sensors are mainly encapsulated in longitudinal ribbons (Fig.5.1 ...
limitations since wider electronics can cover a larger sensing area. All meshes have sharps tip of 45ºto be easily loaded into s ...
very low (0.0025 nN m). This dramatic bending stiffness change facilitates stress localization leading to the buckling of longit ...
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